AML Wafer Bonding System

Manufacturer and model:

Aligner Wafer Bonder System AML AWB04 

General Information:

Bonding of wafers using thermocompression and anodic bonding methods

Key Features:

Unique in-situ alignment capabilities

Wafers from 3" to 6" and also small pieces

1 to 5µm alignment accuracy

Application of High Voltage up to 2.5kV

Platen Temperatures up to 560°C

Compression Forces up to 40,000N

Operation under vacuum down to 2x10-6 mBar

Bonding under reactive gases like N2/H2 mixture

Applications:

Bonding of wafers of same material

Bonding of wafers made of different materials

Bonding of samples using micrometer alignment

Materials:

Si, SiO2, Si covered with metals, others

Start of Operation Date: December 2020

---

BOOK NOW